Services

ACE FIB TEM Lamella  CIRCUIT EDIT
High Resolution SEM imaging | TEM sample preparation
Our Analytical Services
Quality work you can depend on!
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Services

FIB Circuit Edit | TEM | Dual-Beam

ACE provides advanced failure analysis and microscopy services to high tech industries that Semiconductors, IP and litigation analysis, Automotive, Ceramics, Glass, Aerospace, Military & Defense, Batteries, Biotech & Medical, MEMS and solar.

Our key services include TEM, Dual-Beam and FIB Circuit edit. We offer discounts for volume-work and quick turn-around without the “expedite fees”. 

Dual-Beam (FIB-SEM) Services 

  • High resolution Scanning Electron imaging
  • 20nm-100nm TEM lamella sample preparation “lift-out”
  • ION beam nano-machining
  • FIB-SEM cross-section
  • Sample size – Up to 8”
  • Energy Dispersive Spectroscopy (EDS)
  • STEM

Transmission Electron Microscopy (TEM)

  • Sub-Å atomic resolution probe-corrected STEM mode
  • Large area windowless EDS detector (0.45sr)
  • EELS & EDX quantification and mapping
  • Doping and material characterization analysis
  • Defect and Materials analysis
  • Tomography and holography
  • 80, 200, 300kV accelerating voltages

Frontside & Backside FIB circuit edits

  • Advanced capabilities7nm FinFET, 14/16nm FinFET, 28nm
  • Standard capabilities:   40nm, 45nm, 65nm, .13um, .18um, .25um, .35um
  • Wafer capabilities:        4″, 6″, 8″ and 12″ wafer
  • Over 50-years experience
  • Accommodation up to 12″ wafers
  • Free consultations & FIB layout design.
  • Backside sample preparation for FIB