FIB Cross-Section | Dual-Beam

FIB Cross-Section | Dual-Beam FIB-SEM | TEM Lamella Sample Preparation | EDS

ACE offers a full line of Dual-Beam services ranging from: FIB Cross-Section, High resolution SEM imagining, STEM , EDX and TEM Lamella Sample Preparation.

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Competitively priced

  • Discounts for volume work
  • No “rush-surcharge” expedite fees
  • Quick turn-around

Results

  • High resolutions electron imaging analysis
  • 30nm-100nm TEM lamella sample preparation “lift-out”
  • FIB Cross-Section / SEM-EDS
  • EDX, STEM, ION beam nano-machining

Onsite Collaboration

  • Feel free to stop by and work with our analyst on your project

Helios Nanolab 660 Dual Beam

Dual-Beam

System configuration and capabilities

  • TEM Sample Preparation | ~20nm – 100nm Lamella

  • Precision FIB Cross-Section (site specific) | Ultra High-Resolution SEM imaging

  • Elstar high resolution electron column (1nm resolution) Imaging modes: SE/BSE/STEM

  • Sample size – Up to 8” wafer can be loaded through front door; 60% of wafer can be imaged without the need to break or cleave

  • Electron and ion deposition of carbon and platinum for site marking and protection during ion milling

  • EDS analysis using Bruker Quantax Espirit microanalysis software with XFlash 6/60 detector. Elemental data can be collected in Spectral, Line scan and Mapping modes

Dualbeam | FIB Cross-Section Gallery