Precision Site-Specific Microscopy & Surface Analysis
Advanced Circuit Engineers (ACE) provides premier Dual-Beam FIB-SEM services for advanced materials and engineering research. Utilizing the Helios Nanolab 660, we deliver high-fidelity structural characterization and site-specific sample preparation to help our partners solve complex failure analysis and material validation challenges.
Structural Diagnostics & Material Engineering
Our Dual-Beam synergy enables High-Resolution SEM Surface Imaging and precision ion milling. This capability is essential for exposing buried interfaces, localized subsurface features, and multi-layer thin-film stacks with the clarity required for modern materials diagnostics. By integrating In-Situ Gas Injection, we ensure surface protection and precise marking for every sample project.
To support diverse analytical needs, ACE offers Site-Specific Subsurface Profiling across a variety of industrial substrates. Our large-format vacuum chamber accommodates full wafers up to 200mm as well as industrial metallurgical mounts, ensuring that from microscopic components to bulk materials, your data remains accurate and actionable.
- › Precision TEM Lamella Preparation
- › Site-Specific FIB Cross-Sectioning
- › High-Contrast Material Interface Imaging
- › Top-Down & Tilt-View SEM Analysis
- › Integrated Bruker Quantax EDS Mapping
- › Elemental Line Scans & Point Analysis
- › Multi-Detector Signal Acquisition (SE/BSE)
- › Surface Particle ID & Morphology
