Utilizing the Nanolab 660 Dual-Beam (FIB-SEM), ACE offers a full line of applications ranging from: TEM Lamella Sample Preparation service, Failure analysis Cross-Sections, High resolution SEM imaging, nano-machining, STEM and EDX analysis.
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Competitively priced
Discounts for volume work
No “rush-surcharge” expedite fees
Quick turn-around
Results
High resolution Scanning Electron Imaging (HR-SEM)
20nm-100nm TEM lamella sample preparation “lift-out”
FIB Cross-Section
EDX, STEM, ION beam nano-machining
Electrolytic-Electroless Microvia analysis
Onsite Collaboration
Feel free to stop by and work with our analyst on your project
Helios Nanolab 660 Dual Beam
Nanolab 660 System configuration and capabilities
TEM Lamella Preparation service | ~20nm – 100nm Lamella
Electrolytic-Electroless Microvia analysis
Elstar high resolution electron column (1nm resolution) Imaging modes: SE/BSE/STEM
Sample size – Up to 8” wafer can be loaded through front door; 60% of wafer can be imaged without the need to break or cleave
Electron and ion deposition of carbon and platinum for site marking and protection during ion milling
EDS analysis using Bruker Quantax Espirit microanalysis software with XFlash 6/60 detector. Elemental data can be collected in Spectral, Line scan and Mapping modes