ACE provides IC design verification and debug services using a suite of tools.

These include the FIB (focused ion beam) and the E-beam (electron beam).

The FIB can be used to perform:

• Circuit edits and modifications on flip chips and wire bond devices
• Probe point creation

The Ebeam can be used to:

• Probe buried metal layers
• Probe flip chips through Silicon
• Sample voltage over time
• Provide non-loading, non-destructive, high bandwidth measurements
• Display measurements as waveforms