ACE utilizes the state of the art Credence OptiFIB™, Credence IDS P3X™ FIB capable of the following.

• Circuit Modifications
• Packaged devices and bare die
• Wafer edit capability through 200mm
• 45nm Copper and Copper on low K
• Probe point creation for mechanical or e-beam probing
• FIB CAD navigation capability for increased accuracy and efficiency

ACE offers the following services:

• Basic and advanced FIB applications training classes
• GDSII CAD processing
• Device de-capping and FIB layer de-processing measurements
• Technical reports
• Competitive rates and special pricing for large orders
• Offer 24/7 services at no extra charge